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IEEE Computer Society
 
Dallas Chapter
 
27 JUN 2008 Meeting
 
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When: Friday 27 JUN 2008
Meeting & Presentation: 10:30 AM - 12:00 Noon
(No lunch this time)
Where: University of Texas at Dallas
Room ECSS2.410 (in South Engineering Building) (map & directions)
800 West Campbell Road
Richardson, TX 75080
Topic: Next Generation Wireless -- What's Just Around the Corner?  ( .pdf )
Speaker: Dr. Bill Krenik, CTO
Wireless Terminals Business Unit
Texas Instruments -- Dallas
Abstract: The next generation of wireless promises to be revolutionary: Downlink data rates over 100Mbps; camera resolutions over 10Mpixels; high-definition video; context aware user interfaces; satellite positioning and navigation; and many other features. No other consumer electronics devices offer the potential for product volumes over a billion per year; and no other such devices drive the technical challenges of cost, size, and power that are part of everyday life in wireless. This presentation looks at the key market and technical trends of the coming revolution in next generation wireless. Air interface technology, applications, the new Mobile Internet Device (MID) market, and connectivity are discussed. Semiconductor level implementation is covered briefly and some predictions for how these systems will evolve are provided.
Bio: As chief technical officer, Dr. Bill Krenik leads TI's advanced wireless research team. He oversees the study and development of emerging wireless technologies and system architectures, and shapes the impact they will have on the future of wireless communications. He also defines and launches new research initiatives, supports advanced wireless product developments, and manages activity related to wireless industry standards.

Krenik has played an instrumental role in the design of TI's silicon and software technologies, optimizing them in view of the critical technology requirements of mobile handset manufacturers and mobile operators. He is widely respected for his strategic vision and contributions to the development of the industry's first single-chip mobile phone solutions, now shipping in high volume production in many phone models. Known as TI's LoCostoTM family of single-chip solutions, the popular platform employs the company's one-of-a-kind DRPTM technology that applies digital techniques to formerly analog functions to achieve substantial size, power and cost reductions. Krenik is also closely involved in the development of technologies for advanced silicon integration, power management and control, data processing, analog and RF circuit design, communications systems, wireless applications and services, and wireless system architectures.

Krenik serves on several academic and professional boards, and was elected a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2005. He is a registered professional engineer in Texas and holds more than 40 U.S. patents. He speaks frequently at professional industry and technical events and has published numerous articles and technical papers. A well-respected industry expert, he also is frequently quoted in top U.S. trade and business publications, including USA Today, EE Times and IEEE Spectrum.

Krenik has been employed by TI since 1984. He received a doctorate in electrical engineering from the University of Texas, Dallas, in 1993. He also holds a master's degree in electrical engineering from Southern Methodist University and a bachelor's degree in electrical engineering from the University of Minnesota.

Directions: The UTD campus is located at 800 West Campbell Road, Richardson, TX 75080. Meeting attendees and visitors should enter the campus off Campbell Road, between Floyd Road and Waterview, and get a parking pass at the main gate guard station. For more information, see map or contact UTD's main switchboard at (972) 883-2111 for more information.
Cost: Technical Presentation:  FREE to both IEEE CS Members and the general public.
Lunch:  Not Available.

 


 

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